亲，
你还想要个更小封装的蓝牙芯片吗？TI release了一个wafer scale的封装。2.7mm/2.7mm
最新的R2规格里已经包含了他的封装信息和orderable的part number。 http://www.ti.com/lit/gpn/cc2640r2f
BR. Albin
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